Have you had iPhone 7 and 7 Plus Audio Chip Issues? Or you just wonder why your microphone is not working on an iPhone 7. What is the solution for the following Apple iPhone 7 sound problems? →
The iPhone 7 actually has 4 microphones. Two of them are located at the bottom of the device. The third microphone is found between the True Tone flash and iSight camera. And the last microphone is located inside the earpiece.
Either your iPhone’s microphone system is glitching or the physical microphone (hardware) itself is damaged. Unfortunately for microphone problems that are attributed to physical or liquid damage, service is usually required for them to be resolved. The same applies to microphone issues that are inflicted by software errors.
Microphone and sound problems could be a post-update issue. If that’s the case, then most likely it will be resolved by another update containing the required fix patch. If this happens to be a widespread issue following the update to iOS 11. This is why it’s highly recommended to install new updates available on your device.
The update is basically the same thing, while loading it tests everything and gets failure results from the Audio IC. People whose Audio IC fails at other times don’t make a connection. So, updates just revealed the symptoms from the Audio IC chip having failing connections to the logic board. You can either pay to do an out-of-warranty replacement of your iPhone or you can locate a competent 3rd party repair site that can do board level soldering. They should re-ball 4 connections between the Audio IC and the logic board which will remedy the situation. Many experts believe that the audio chip issues that iPhone 7 and 7 plus users are facing may be due to aging.
The iPhone 7 and 7 plus were a tremendous hit when they first came out in September 2016. These flagship Apple devices resembled their predecessors in their outward appearance but the real strengths of the iPhone 7 and 7 plus lie in the internal features.
The phones had a camera with fantastic performance, dual speakers and most importantly water-resistance that the iPhones before did not have. People who bought the iPhone 7 or 7 plus sang nothing but praises about the 7 series and its amazing capabilities.
However, as time went on some people began experiencing issues among which the most common are problems with the audio IC.
The most common audio issues in the iPhone 7 and 7 plus have the same underlying cause! A logic board fault in which the audio chip is separated or loosened from the motherboard, this issue is also referred to as the “Loop Disease.”
It is interesting that the issue occurs in the same pad, which is the C12. The C12 serves as the connection of the master clock line to the audio integrated circuit chip.
A similar problem occurred in old iPhone 6/6plus with the touch integrated circuit chip, which was dubbed as the “touch disease.” Both these issues occur due to the daily use of phones and their inherent construction.
The C12 construction is fragile; and especially, if you are a rough user, the audio board can easily get damaged. The phone experiences a significant amount of flexion even if you regularly put your phone in your pocket or bag and take it out several times daily.
The structure of the audio IC gets weak; the main weak point is the M1 pad under the touch chip. Which easily gets affected by flexion. This same problem occurred in iPhone 6; and unfortunately, even after the problem was identified, Apple did not do anything to either strengthen the M1 pad; neither did they come up with a solution to protect the pad from getting damaged with normal flexion.
It has been observed that the C12 is poorly attached to the phone with results in audio ic failures. With time, the phone’s audio stops functioning completely, and it even hinders turning the phone on.
The best thing about it that the C12 audio pad is repairable. Also, if your phone is not in warranty, it won’t cost thousands of pounds. If you are willing to fix it, then the audio pad can be fixed by lifting the audio IC chip and adding a micro-gauge wire.
This will strengthen the M1 pad; however, it is also essential to leave a slight margin. So that the board has the leverage, and it can easily handle the normal flexion of this area. With this simple technique, you will not only be able to fix iPhone 7 audio chip issue that includes the speaker and mic issue, but this fix will also prevent your phone from the same problem in the future.
What is the reason?
The problem is Apple’s faulty design.
“The materials used in the outer casing of the iPhone are insufficient and inadequate to protect the internal components,” which ultimately results in the audio chip losing electrical contact with the logic board due to “bending” the device during normal use.
In particular, most problems are caused by the C12 “master clock” pad, which is essential for the operation of the audio IC and detaches. (Other pillows such as E12, G12, and H12 are also sometimes damaged, but C12 is the most significant).
If we fix the broken pad on the mainboard and the telephone is dropped after it has been fixed, or even if it bends a little, then the fault of the audio chip will appear again, as another conductor lead will break.
This is why we advise against keeping the phone in your hip pocket, because there the phone is more prone to bending. This is the reason we give only 1 month warranty on this repair.
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